New Product Announcement
You asked and we delivered! Our FIB-optimized E-chips for Fusion electrical experiments have undergone a makeover 
Our most popular electrical E-chip style (and we have many!), the FIB-Optimized E-chip, was the first of its kind released for in situ electrical experiments in the TEM. It simplifies FIB lamella landing and creating electrical contact to MEMS devices, preventing shorts and allowing thinning from both sides. Researchers commonly use them to study resistive switching, p-n junctions, and other characteristics of electronic devices.
Our latest generation FIB-optimized E-chips has everything you have been asking for:
📏 narrower sample gap, shortened from 20 microns to 5 microns ➡️ shorter lamella means faster preparation
⚡ up to 9x lower device resistance from widening the metal leads ➡️ lower resistance means higher voltage can be applied to the sample while also mitigating joule heating
📋 dual-notch option (like that pictured) enabling new types of experiments ➡️ better isolation between leads enables Hall effect measurements and characterization of multi-terminal devices
When can you get your hands on these, you ask? They are ready to order now! Reach out to your local Protochips representative or send us an email at orders@protochips.com and we will help you.
See a list of our International Channel Partners here:
https://www.protochips.com/about-us/our-distributors/
Don’t own the Fusion AX system yet? Read more about it here: https://www.protochips.com/solutions/in-situ-tem-solutions/in-situ-heating-and-electrical/
Find out what researchers are studying with our electrical E-chips for Fusion by sifting through our bibliography here:
We hope you are as excited as we are!
