Tuesday publication post! 📖 This latest study highlights a transformations in silver nanowires (AgNW) as transparent conducting electrodes (TCE’s) at the nanoscale using the #FusionAX system to apply in situ TEM biasing. The study reveals how stacking faults (SFs) can significantly enhance the durability of nanowire-based devices.
🔬The study finds that SFs effectively suppress the migration of surface atoms, mitigating electromigration effects and the parallel facets to the {111} plane slow void growth by an astonishing 135 times, promoting stability.
⚡Planar defects like SFs provide an intrinsic method to extend the operational lifetimes of devices, offering a pathway to more reliable, long-lasting electronics.
💡 From flexible electronics to advanced interconnects, this work underscores the importance of nanoscale engineering in redefining material performance.
To summarize, this work shows the possibility of extending the lifetimes of NWs through the incorporation of SFs, rather than employing additional capping layers or complex fabrication procedures!
Want to know more about this work? Read it here!
https://onlinelibrary.wiley.com/doi/10.1002/aelm.202201054
Want to know more about using Fusion AX for #ElectronicDevice studies?
https://www.protochips.com/solutions/by-applications/electronic-devices/
