Over the last 30 years or so, the reliance people have on electronic devices for everyday tasks has grown exponentially. Your calendar, phone, notebook, reminders, vehicle, and more, all depend heavily on different electronic devices to perform.
As time goes on, the expectations for these electronic devices does not change: exceptional performance, long lifetime, and reasonable pricing. In order to meet, and preferably improve, on these demands, research must be done to continue to scale these devices down and make them smaller. Making them smaller will:
- Improve performance as you can fit more functionality on a chip
- Reduce cost to manufacture as you can fit more die on a wafer
As smaller devices are invented, electrical characterization must be done to ensure the new configurations actually work. This is where in situ characterization in the TEM becomes important. The Fusion AX system enables quantitative electrical characterization of devices within the TEM to correlate structural changes to performance while under operation to evaluate reliability.
Due to the small size of devices, the TEM is the ideal platform for visually observing structural changes that can lead to improved or decreased electrical performance. Fusion AX provides an entire workflow, from sample preparation to data publication, for reproducible, quantitative data that drives continuous scaling of electronic devices.
