Electronic devices, a subset of hardware, manipulate electrical energy to amplify and transmit signals, making them indispensable in modern life. From phones and computers to refrigerators andthermostats, they power the gadgets and appliances we rely on daily. As our world grows increasinglydependent on these technologies, the demand for robust, reliable, smaller, and more cost-effectivedevices continues to surge—benefiting both manufacturers and consumers alike.In situ transmission electron microscopy (TEM) provides an invaluable platform for studyingelectronic devices, offering real-time analysis of device structure and electrical behavior underoperating conditions at sub-nanometer resolution.
This capability allows researchers to investigate phenomena such as electromigration in interconnects, interface dynamics in heterostructures, or phase changes under applied biases, all of which influence device performance and lifespan. Insights gained through these studies are instrumental in optimizing device designs to enhance functionality and durability.
The Fusion AX: Advanced In Situ TEM Analysis for Electronics Research
Protochips’ Fusion AX in situ heating and biasing system is a uniquely designed double-tilt TEM holder designed to support diverse research applications, including materials science, nanoelectronics, semiconductors, energy materials, and catalysis. The system offers biasing and heating modalities, enabling real-time electrical, thermal, or electrothermal characterizations of samples under relevant operating conditions. By replicating these relevant environments within the vacuum of the TEM, researchers gain a deeper understanding of how nanoscale dynamics influence macroscale material behavior.
Protochips’ Fusion AX workflow solution allows researchers to isolate and study specific layers or components of electronic devices under operating conditions, enabling them to understand how nanoscale structural and functional changes contribute to device breakdown and failure over time. The intricate design of the system minimizes electrical leakage and parasitics, ensuring accurate and reliable electrical measurements down to the sub-nanoamp level.
To enhance user success, the Fusion AX workflow includes tools for critical sample preparation steps, such as FIB lamella deposition, and is supported by the intuitive AXON software for image stabilization and data management. Together, these features empower researchers to confidently analyze and innovate in the field of electronic devices, driving advancements in performance and reliability.
