C-flat uses no polymers in its production. This means C-flat is shipped clean, so it’s ready to use out of the box and requires no solvent washing steps prior to use, leading to less breakage of the holey carbon film.
Researchers around the world have reported that the ultra-flat surface of C-flat leads to even ice thickness and uniform particle distribution, allowing for superior 3-D reconstructions.
C-flat is readily available in several standard array patterns including hole diameters/hole spacing of 1.2/1.3, 2/1, 2/2, 2/4, 4/2, and a multihole pattern. C-flat is supported by either a 200 mesh or 400 mesh copper or gold TEM grid and sold in quantities of 50, or 100.
C-flat products are completely defined by 4 parameters: the hole diameter, pitch of the holey carbon film, the material type, and mesh size. The regular thickness of the carbon film is approximately 20 nm with a thick carbon option of approximately 40 nm.
Whether 1 µm holes are needed for very high magnifications with ultra-high resolution cameras or large open areas are needed for larger specimens, C-flat is the perfect holey carbon grid. Custom grids are also available; feel free to contact us for your specific C-flat needs.
C-flat holey carbon grids provide the ideal specimen support to achieve high resolution data in cryoTEM making it the perfect choice for single particle analysis, cryo electron tomography and automated TEM analysis.
Numerous researchers have reported that the ultra-flat surface of C-flat leads to even ice thickness and uniform particle distribution. This optimal particle distribution results in superior data collection as compared with other holey support films. Various hole sizes are available to accommodate the different magnifications necessary for quantitative TEM analysis.
Measuring critical dimensions of transistor gate structures and other semiconductor thin films requires TEM-based metrology. C-flat provides a regular array of analysis sites covered with a thin, amorphous sample support, features that are required for automated CD-TEM characterization.